FROM CIRCUIT INTENT TO ELECTRONICS
Electronic Engineering
Electronic engineering at AJE bridges functional requirements and real-world manufacturability. We design circuits, PCBs, and assembled electronics with the same mindset we use on the factory floor—component availability, yield stability, and compliance are considered from day one.
Service Stages
Defining HOW your product functions
PCB & Schematic Design
PCB & schematic design defines the electrical architecture of your product and translates functional requirements into a stable, manufacturable circuit. This stage establishes power integrity, signal integrity, component strategy, and board architecture—while ensuring alignment with enclosure constraints, assembly processes, and regulatory expectations. At AJE, schematic and PCB design are developed with PCBA, testing, and certification in mind, not as isolated engineering exercises.
What We Support
System-level electrical architecture definition
Board stack-up and impedance planning
Power supply and power distribution design
EMI-aware schematic and layout decisions
MCU, SoC, and peripheral integration
Mechanical–electrical interface coordination
High-speed and sensitive signal routing strategy
Design iteration support through EVT/DVT
Component selection aligned with lifecycle and sourcing
Production-ready design freeze support
What We Consider
Beyond functional correctness, we actively manage constraints that affect downstream production:
- Component availability, alternates, and lifecycle risk
- EMI/EMC behavior influenced by layout and grounding
- Thermal behavior at component and board level
- Assembly orientation, panelization, and test access
- Mechanical tolerance interaction with enclosures
- Cost impact of package choices and layer count
This ensures the PCB design survives scale-up—not just lab testing.
What We Need
To define the electronic foundation correctly, we will ask for:
Functional Requirements
- Core functions the PCB must support
- Signal types, control logic, and processing needs
- Required interfaces (USB, UART, CAN, SPI, I²C, etc.)
- Performance expectations and operating limits
System Architecture Inputs
- Block diagram or feature breakdown
- MCU / SoC preferences or restrictions
- Power architecture expectations
- Interaction with firmware and peripherals
Mechanical & Integration Constraints
- Board size, shape, and mounting limitations
- Connector positions and keep-out zones
- Stack-up constraints with enclosure design
- Thermal and shielding considerations
Cost, Supply & Lifecycle Targets
- Target BOM cost range
- Component availability expectations
- Preferred suppliers or restricted parts
- Product lifecycle and revision outlook
Typical Timeline & Criteria
Typical duration:
4-8 weeks, depending on board complexity and function difficulty.
Considered complete when:
- Schematic and PCB layout are internally verifie
- Critical components are locked or dual-sourced
- Design is ready for EVT build and PCBA
- Electrical decisions are frozen for assembly planning
TURNING DESIGNS INTO HARDWARE
PCBA Design
PCBA process converts validated PCB designs into functional electronic assemblies. This stage focuses on process stability, yield, and repeatability—ensuring that what works in EVT can be built reliably at scale. At AJE, PCBA is tightly integrated with design feedback, fixture planning, and quality control.
What We Support
SMT process planning and line compatibility
Programming and firmware loading support
Component sourcing and material preparation
AOI, SPI, and in-line inspection coordination
Stencil, reflow, and solder profile optimization
EVT / DVT / PVT build execution
Through-hole and mixed-technology assembly
Assembly feedback loop to design team
What We Consider
Assembly success depends on factors often invisible in CAD:
- Pad geometry and solderability risk
- Component placement affecting yield and rework
- Package sensitivity and moisture handling
- Board warpage and thermal stress during reflow
- Programming access and test-point strategy
- Scrap, rework, and line balancing risk
These considerations protect cost and schedule during ramp-up.
What We Need
To execute efficiently, we align with clients on:
Build Scope & Volume Planning
- Prototype vs pilot vs mass production intent
- Expected quantities per build stage
- Single-sided or double-sided assembly
- Special process requirements
Component & Packaging Definition
- Finalized component packages and footprints
- Moisture-sensitive or special-handling parts
- Connector, battery, and display assembly needs
- Sub-assembly or modular build considerations
Process & Yield Expectations
- Assembly quality targets
- Acceptable yield and rework thresholds
- Cosmetic vs functional acceptance criteria
- Traceability and serialization needs
Documentation & Release Readiness
- BOM status and revision control
- Pick-and-place, stencil, and panelization data
- Assembly drawings and notes
- Build approval and freeze points
Typical Timeline & Criteria
Typical duration:
1–3 weeks per build phase, depending on volume and complexity.
Considered complete when:
- Boards meet electrical and visual acceptance criteria
- Yield is stable and repeatable
- Assembly issues are resolved or fed back to design
- Units are ready for system integration or validation
PROVING PERFORMANCE BEFORE SCALE
Testing & Validation
Testing & validation ensures that electronic assemblies perform reliably under real-world conditions and meet regulatory and customer expectations. This stage validates not just functionality, but robustness—before committing to tooling, certification, or mass production.
What We Support
Functional test definition and execution
Failure analysis and root cause investigation
Power, signal, and interface verification
Pre-compliance testing preparation
Environmental and stress-related testing support
Validation reporting and documentation
Firmware–hardware interaction validation
Design refinement based on test results
What We Consider
At this stage, we actively balance design intent against production economics:
- Tooling complexity vs long-term unit cost
- Assembly time and labor sensitivity
- Cosmetic risk caused by gates, ejectors, and parting lines
- Material shrinkage, warpage, and flow behavior
- Fixture, jig, and automation compatibility
- Scalability from pilot builds to mass production
This prevents late-stage tooling changes, line inefficiencies, and quality instability.
What We Need
To execute DFM/DFA effectively, we align on:
Production Assumptions
- Target annual volume and ramp-up plan
- Expected production location and capability level
Cost & Quality Priorities
- Cost vs quality vs speed trade-off expectations
- Acceptable cosmetic standards and defect thresholds
Manufacturing Strategy
- Preferred suppliers or open sourcing
- Manual vs automated assembly direction
Typical Timeline & Criteria
Typical duration:
2–4 weeks, depending on tooling complexity and risk tolerance.
Considered complete when:
- Design is tooling-ready with no open manufacturability risks
- Assembly flow is defined and repeatable
- Cost, yield, and quality risks are controlled
Rushed timelines without production clarity will increase long-term cost, not shorten launch.
