AJE ELECTRONIC TECHNOLOGY
OUR RESEARCH & DEVELOPMENT
R&D is where product risk is removed before scale. Our development focuses on engineering feasibility, cost control, and manufacturability from day one—so we move from concept to mass production.
Engineering review and feasibility validation transform early concepts into production-ready designs. Our team evaluates structure, components, cost targets, and manufacturing constraints, ensuring every decision supports scalability, reliability, and efficient mass production before tooling, certification, or supply chain commitment begins.
Define your success
Product Definition & Engineering Feasibility
Early engineering decisions determine whether a product scales smoothly or accumulates hidden risk. Our product definition phase focuses on turning concepts into production-ready architectures by validating requirements, cost targets, and manufacturability before any tooling or certification investment.
Capability Highlights
Requirement & Use-Case Validation
Translate customer inputs into clear engineering specifications, including electrical parameters, environmental conditions, regulatory targets, and usage scenarios. Typical definition cycles: 1–2 weeks.
System Architecture Planning
Define complete product architecture covering electronics, mechanical structure, power design, and interfaces, ensuring compatibility with SMT, assembly, and test processes from the outset.
Early DFM / DFA / DFT Reviews
Conduct manufacturing-driven design reviews before layout freeze to reduce assembly complexity, improve test access, and prevent tooling rework. This stage typically reduces later design changes by 30–50%.
Cost & Complexity Evaluation
Preliminary BOM and process cost modeling to assess unit cost, tooling investment, and scalability before mold or PCB commitment—supporting informed decisions on materials, structure, and production volume targets.
Electronics & Firmware Development
Electronics and firmware development covering schematic design, PCB layout, MCU selection, embedded software architecture, and validation with production-ready intent.
BUILD THE CORE
Our Development Processes
We design and develop robust, scalable electronics and firmware that are optimized for real-world production, long-term reliability, and future iteration. Our team covers schematic design, multi-layer PCB layout, MCU and wireless platform selection, and firmware architecture—from low-level drivers to application logic. Designs are created with testability, programmability, EMC compliance, and manufacturing yield in mind, supporting smooth EVT/DVT/PVT progression and stable mass production.
SPECIALTY 1
RFID & Biometric Module
We develop and integrate RFID and biometric recognition modules for secure identification and authentication scenarios.
- RFID (LF/HF/UHF) module integration
- Fingerprint sensor selection and interface design
- Secure data handling and authentication logic
- Integration with access control, payment, and identity systems
Typical use cases: Access control, attendance systems, smart locks, authentication terminals
SPECIALTY 2
Bluetooth, Wi-Fi & NB-IoT Module Applications
We design wireless-enabled products using mainstream short-range and long-range communication technologies.
- Bluetooth (BLE / Classic) module integration
- Wi-Fi connectivity for device-to-cloud communication
- NB-IoT solutions for low-power wide-area applications
- Antenna layout, RF matching, and signal optimization
Typical use cases: IoT devices, remote monitoring, smart home and industrial connectivity
SPECIALTY 3
Embedded Software & Module Integration
We provide embedded software development tightly coupled with hardware design to ensure stable system behavior.
- MCU firmware architecture and driver development
- Communication protocol implementation
- Modular software design for scalability and updates
- Hardware–software co-debugging and validation
Typical use cases: Access control, attendance systems, smart locks, authentication terminals
SPECIALTY 4
PCBA Solution Implementation
We deliver complete PCBA solutions, from design to production-ready boards.
- Schematic design and multi-layer PCB layout
- Component selection optimized for cost and supply stability
- SMT + DIP mixed-technology support
- Design aligned with DFM / DFA / DFT requirements
Typical board types: Control boards, power boards, communication boards, main logic boards
SPECIALTY 5
IoT Product Manufacturing
We transform validated designs into mass-producible smart products, supporting the full production lifecycle.
- EVT / DVT / PVT build support
- Functional testing and programming during production
- Assembly, testing, and final inspection
- Export-oriented OEM / ODM manufacturing
Typical products: Smart electronics, connected devices, intelligent modules and terminals
What differentiates us is not a single technology, but the ability to connect modules, software, PCBA, and manufacturing into one coherent system—reducing development risk, shortening timelines, and ensuring production readiness from day one.
Production-ready mechanical design optimized for injection molding, assembly efficiency, and long-term reliability at scale.
Production-Ready Design
Mechanical & Industrial Engineering
Our mechanical and industrial engineering team designs with full production intent from the very beginning. We focus on structures optimized for injection molding, assembly efficiency, and long-term reliability rather than prototype-only solutions. Each design considers tolerance stack-up, material behavior, heat dissipation, and mechanical strength under real operating conditions. By aligning part geometry with tooling strategy and mold life expectations, we reduce manufacturing risk, control cost, and ensure stable quality as projects scale from pilot builds to high-volume mass production.
Structural Design for Injection Molding & Assembly
- Enclosure and structural design optimized for single-shot, multi-cavity, insert, and overmolding processes
- Parting line, draft angle, rib, boss, and snap-fit design aligned with molding best practices
- Assembly-oriented structures to minimize part count and manual operations
Tolerance Stack-Up & Material Engineering
- Full tolerance stack-up analysis to ensure consistent fit and function in mass production
- Material selection based on mechanical strength, thermal behavior, appearance, and long-term stability
- Support for engineering plastics including ABS, PC, PC+ABS, PA, PBT, PP, and reinforced materials
Thermal Management & Mechanical Reliability
- Passive heat dissipation design using structural airflow, heat paths, and material conductivity
- Mechanical reinforcement for vibration, drop, and long-term fatigue resistance
- Reliability considerations for temperature cycling, humidity, and continuous operation
Tooling Cost & Mold Life Optimization
- Early design optimization to reduce tooling complexity and avoid unnecessary slides and lifters
- Gate, runner, and ejection system coordination to improve mold stability and surface quality
- Mold life targets defined and validated based on material choice and production volume
Production-Intent Validation
- All designs reviewed against DFM, DFA, and real production constraints
- No prototype-only shortcuts—structures, tolerances, and materials match final manufacturing intent
- Designs prepared for direct transition into mass production without rework
Turning designs into manufacturable reality
Prototyping & Validation
We support rapid and structured prototyping to validate design intent, functionality, and manufacturability before mass production. Using a combination of 3D printing, CNC machining, and soft tooling, we quickly build and refine prototypes aligned with final production processes. Our team supports full EVT / DVT / PVT cycles, validating electrical performance, mechanical fit, thermal behavior, and assembly logic. Testing methods, fixtures, and work instructions are verified early to eliminate risks before tooling and scale-up.
